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MGF06F Series

Fuse

MGF06F Series 為 Fuse,採用 0603 封裝。

0603 符合 RoHS 無鹵 現貨供應
0603 3D package render
封裝 — 0603
產品特性
  • High inrush current withstanding capability
  • Compatible with reflow and wave solder
  • Ceramic and glass construction
  • Excellent environmental integrity
  • One time positive disconnect
  • Lead Free and 無鹵 material
應用領域
  • Features 2. Primary Characteristics
  • % of Current Rating Opening Time at 25°C
  • 100% 4 hours min
  • 200% 60 seconds max
  • Rated Current: 250mA to 8A Simplified Outline
關鍵規格
Package
0603
Type
Fast-Acting Thin Film Chip Fuse
Rated Current
250mA – 8A
Rated Voltage
— (per variant)
Breaking Capacity
50A @ rated voltage
Nominal Cold Resistance
7 – 3250 mΩ (per variant)
Nominal Melting I²t
0.00042 – 3.0 A²·sec
Typ. Voltage Drop
75 – 893 mV
Features
High inrush capability; reflow + wave solder compatible; ceramic + glass; RoHS; halogen-free. 15 current variants (0250A, 0375A, 0500A, 0750A, 1000A, 1500A, 2000A, 2500A, 3000A, 3500A, 4000A, 5000A, 6000A, 7000A, 8000A). DDR5 RDIMM uses -6000A (rev 0/1) or -7000A (rev 2).
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